
Good News from the Chinese tech giant Xiaomi, that their latest flagship smartphone, which is Xiaomi 15S Pro, is now getting attention as it is going to feature the in-house chipset that is XRING O1. The 15S Pro also has the other in-house designed components.
Along with the XRING O1, Xiaomi 15S Pro is also going to have Xiaomi’s in-house XP2210C power management chip and the Surge P3 wired charging controller. Still, apart from these custom components, Xiaomi is also dependent on third-party suppliers to bring the 15S Pro to market.
Xiaomi 15s Pro Internals
As per the teardown, SK Hynix supplies the latest LPDDR5T RAM for the Xiaomi 15S Pro. It is using Package-on-Package (PoP) integration to which makes the design compact. Meanwhile, Micron has provided the UFS 4.1 storage.
If we talk about the connectivity, then Xiaomi relies on MediaTek. This device uses the MT6195W RF transceiver, T800 (MT6980W) modem, and the MT6639BEW Wi-Fi/Bluetooth chip.
While the NFC and UWB are sourced from NXP, which is a Dutch-American company and an American semiconductor company, Cirrus Logic will handle the audio.
Other key component suppliers for the Xiaomi 15S Pro are Southchip Semiconductor for secondary charging, NuVolta for wireless charging, STMicroelectronics for various sensors, and Vanchip for RF modules
As we know, Xiaomi is making progress toward chip independence, but it still depends on third-party suppliers for the important component to power its flagship device. This is not surprising, as this is common in today’s phone industry.
Hardware companies rarely build everything in-house. To provide the phone at this price point, the company smartly partners with the best suppliers to balance the quality and the cost without overspending
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